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Semiconductor boom, but South Korea\'s chip equipment exports to China fall

South Korea\'s semiconductor exports rose past $40 billion for the first time on a monthly basis, extending a 16-month streak of gains. But exports of semiconductor manufacturing equipment to China edged down in June even as memory chip shipments surged. The article points to China focusing on domestically made back-end processing equipment as the United States tightens controls on advanced lithography tools. Hybrid bonding and other back-end processes are highlighted as key areas of Chinese localisation.

Industry

China tungsten curbs disrupt WF6 supplies, raising risks for HBM and AI chip output

The push to expand AI semiconductor output is straining supply chains for specialty electronic gases, an analysis said. China’s controls on high-purity tungsten exports have led to disruptions in Japan’s supply of tungsten hexafluoride (WF6), raising new supply-chain risks for high-bandwidth memory, DRAM and advanced logic chips. Usage of specialty gases rises sharply as processes shrink and as HBM and 3D NAND output expands. Alternative suppliers are limited, while Chinese producers are expanding capacity and prices have risen.

Industry

Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields

Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memory and 3D stacking. The lineup includes CMP, electrochemical deposition and PECVD systems, two e-beam metrology tools, and an upgraded epitaxy system for DRAM peripheral transistors.