South Korea's Ministry of Science and ICT said on Feb. 10 it will push ahead with training specialised talent in advanced semiconductor packaging, a core technology for AI semiconductors, in connection with upgrading national infrastructure.

To that end, the Nano Fab Center, a public semiconductor fab, and the Korea Microelectronics and Packaging Society signed a memorandum of understanding on Feb. 11 in Seoul's Gangnam district to train specialised advanced packaging talent.

The ministry has been supporting the build-out of key process equipment and technologies including through-silicon via (TSV), redistribution layers (RDL) and interposers since 2024, investing 49.5 billion won to strengthen the advanced packaging ecosystem.

Under the MOU, the Nano Fab Center plans to run training courses with direct participation by experts from the society. The ministry plans to combine the centre's infrastructure with the expertise of society officials to produce a total of 80 job-ready workers a year.

The programme will be split into a 14-week long course for science and engineering graduates and a five-day advanced course for employees and researchers. It will raise the share of hands-on training to more than 80 percent.

Lee Kang-woo (이강우), director of the Fundamental Technology Division at the ministry, said, "This cooperation model will play an important role in strengthening South Korea's global competitiveness in the semiconductor back-end process field."