Samsung Electronics has joined efforts to help shape the next-generation standard for semiconductor lithography tools. Samsung said on Tuesday it will participate in ASML's "large mask consortium" and jointly develop next-generation 12-inch photomasks. Based on the cooperation, it decided to introduce high-NA EUV tools into advanced DRAM manufacturing processes by 2028.

A photomask is a precision template engraved with fine circuit patterns, used in lithography equipment to transfer patterns onto wafers with light, and the precision of the process determines semiconductor performance and yield. The "large mask consortium" is a consultative group aimed at converting the currently used 6-inch masks to 12-inch masks. It plans to jointly monitor global technology trends related to lithography tools and photomasks and carry out cooperation activities such as joint research and standards development. Six-inch masks have been used in semiconductor lithography processes so far.

Adopting high-NA EUV lithography tools, which increase resolution by widening the lens aperture, and switching to 12-inch masks can ease constraints from stitching work that involves patterning in segments and connecting them. The company said this can raise fab productivity and lower chip manufacturing costs.

In addition, because semiconductors require precise placement of tens of billions of transistors at the design stage, a 12-inch mask allows full use of the benefits of high-NA EUV equipment, enabling economical production. Samsung said it is expected to play a key role in the shift to 12-inch photomasks based on its experience using EUV in both memory and foundry manufacturing.

Samsung also plans to strengthen cooperation with ASML through 2028 to introduce high-NA EUV into advanced DRAM manufacturing. It is the industry's first attempt to apply the equipment to memory manufacturing. That means next-generation lithography processes will be applied to advanced memory as well, following foundry processes. Samsung and ASML plan to continue seeking additional opportunities for cooperation in areas including advanced memory and innovative manufacturing methods.

Jun Young-hyun (전영현), vice chairman and CEO of Samsung Electronics, said, "The advent of the AI era is changing the paradigm of the semiconductor industry and further raising the importance of technological innovation across the entire value chain." He said Samsung will continue its leadership in advanced semiconductor manufacturing, including foundry and memory, based on innovative technology and strong partnerships, and will lay the technological foundation for "Next AI" by further strengthening cooperation with ASML.

ASML CEO Christophe Fouquet (크리스토프 푸케) said, "Samsung Electronics has long been one of ASML's most important innovation partners, and together we have advanced technologies that form the foundation of modern semiconductor manufacturing." He said he looks forward to leading innovation for next-generation semiconductor manufacturing with Samsung in a new era led by AI.