CoAsia Semi said on Jan. 28 it has started supplying SoC products applying 3D IC packaging and has expanded its business into next-generation semiconductor packaging. It said this is the first time South Korea’s design services industry has supplied products applying a 3D IC package structure.

The product uses a 3D IC package that vertically stacks a custom DRAM using TSV technology with an SoC. A 3D IC package is a structure that vertically stacks an SoC. Compared with existing 2D and 2.5D packages, it can shorten signal transmission paths and expand bandwidth.

That can improve performance, power efficiency and integration density at the same time, it said. The company expects its use to expand in products requiring high-performance computing, including AI, data centres and autonomous driving.

CoAsia Semi began supplying the product from this month for customer certification and testing. It plans to enter full-scale mass production within 2026. Customer companies and contract details will not be disclosed at a request to protect trade secrets.

Chief Executive Shin Dong-su (신동수) said, "The result of proactively investing in the development of next-generation technology called 3D IC, without resting on existing technology areas such as HBM and advanced packaging, has led to this product supply." He said, "In a global semiconductor export regulation environment, we secured a business foundation without restrictions on collaboration with overseas customers, including China, as we were among domestic design houses to proactively meet export standards conformity and obtain export approval."