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AI & Enterprise

MSIT to work with AMD on AI chips, help Korean NPUs expand globally

South Korea\'s Ministry of Science and ICT will cooperate with AMD to expand the domestic AI semiconductor ecosystem, including linking AMD CPUs and GPUs with Korean NPUs to build and test heterogeneous AI computing infrastructure. The ministry said it signed an MOU with AMD in San Francisco. The sides also plan cooperation in AI-based scientific research through NAIS. AMD plans to set up an AI Center of Excellence in South Korea and support university programs and joint research.

Industry

Samsung Electronics to supply 2nm foundry and HBM to Broadcom

Samsung Electronics has begun large-scale cooperation with Broadcom in the AI semiconductor infrastructure market. Samsung said it signed a strategic memorandum of understanding with Broadcom at an AI Summit in San Francisco on July 24 local time to build next-generation AI infrastructure. The companies plan cooperation worth more than $200 billion through 2030 across memory, foundry and advanced packaging. Samsung will supply HBM, including HBM4 and HBM4E, and apply processes of 2 nm or below for key Broadcom chips.

Industry

Germany DDR5 prices surge 448 percent year on year, may rise further through 2027 CPUs

DDR5 memory prices in Germany\'s retail market have jumped to a record high, rising to 448 percent compared with levels before a surge in memory prices, TechRadar reported. Data from 3DCenter show DDR5 prices fell to 408 percent in March before rebounding to 419 percent in June and 448 percent in July. The report also cited talk that TSMC could raise chip production costs next year by up to 10 percent, with some orders facing up to 15 percent more.