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Industry

Design houses move from outsourced chip design to AI chip architecture

Design house (DSP) companies that once focused on outsourced semiconductor design are expanding in both contract pricing and funding scale as AI chip mass production becomes harder with foundry steps alone after 2-nanometre nodes. With physical limits nearing, 2.5D and 3D stacking and chiplets are becoming key, making advanced packaging and interconnect new battlegrounds. Firms are shifting toward integrated design platforms and infrastructure architecture partnerships, alongside rising high-value project shares and larger financings.

Industry

TSMC unveils roadmap through 2029 featuring A13, A12 and N2U processes

TSMC, the world’s largest foundry, unveiled its semiconductor process roadmap through 2029, introducing next-generation A13, A12 and N2U processes. It adjusted parts of its existing plan, pushing A16 mass production to 2027 to match key customer product schedules. The company said A13 targets a 6 percent chip area reduction while keeping design rules, and N2U aims performance and power gains. TSMC also highlighted packaging technologies including CoWoS and SoW-X.

Industry

How AI made Taiwan a $4 trillion economic powerhouse

Taiwan’s stock market capitalisation has swelled to $4.14 trillion this month, overtaking Britain to become the world’s seventh-largest market. A key driver has been a surge in semiconductor demand linked to the spread of artificial intelligence, with TSMC at the centre of the shift. TSMC posted strong first-quarter profit and revenue growth, while foreign investors bought $8.9 billion of Taiwan shares in April. Export orders also jumped in March.