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Samsung Electronics\' turnkey strategy aims to reverse market share in HBM4

Samsung Electronics is moving to counter rivals in the next-generation high-bandwidth memory market by bringing base die production in-house. As HBM4 increasingly requires foundry processes on the base die, Samsung is highlighting its ability to combine design, foundry and packaging in a turnkey approach. The company has signed an MOU with AMD for primary HBM4 supply and is discussing broader cooperation with Nvidia, while challenges such as wafer warpage and low yields remain.