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Samsung Electro-Mechanics, Nvidia to expand dedicated AI substrate fabs with joint investment

Samsung Electro-Mechanics will expand its AI semiconductor substrate plants through joint investment with Nvidia, it said on Oct. 21. The companies formed a strategic business partnership under which Samsung Electro-Mechanics will supply package substrates to Nvidia for multiple years from 2026. Production will be handled at its Sejong and Busan sites, where dedicated lines will be added. Items include substrates for Nvidia computing chipsets and package substrates for network switches.

Industry

U.S. clean energy policy change ripples as tax credits cut for 3,446 projects

More than 3,400 U.S. manufacturing projects and sites have been affected by changes to clean energy support policies, including reduced tax credits and project suspensions, an analysis showed. The BlueGreen Alliance released an interactive map tracking 3,446 affected clean energy-related projects nationwide, drawing on eight databases. The policy shift stems from a budget reconciliation law passed in 2025 that ended or reduced many tax benefits expanded under the Inflation Reduction Act.

Industry

Samsung Electro-Mechanics, LG Innotek face off over next-generation substrates at KPCA

Samsung Electro-Mechanics and LG Innotek are unveiling new semiconductor package substrate technologies at KPCA Show 2026 in Incheon from Sept. 9 to 11. Samsung Electro-Mechanics is exhibiting five items including 2.5D and 2.1D package substrates, glass substrates and automotive FCBGA. LG Innotek is debuting an AI accelerator FC-BGA and plans mass production of high value-added FC-BGA for AI training and inference in 2027. Both are accelerating glass substrate development.