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As AI chips grow, packaging substrates shift from round wafers to square panels

As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.

Telecommunications & Media

Samsung Electronics to unveil new Galaxy S26 series model at Aug. 27 event

Samsung Electronics will unveil a new model in its Galaxy S26 series, the company said. Samsung Electronics said in its newsroom it will hold a “Samsung Galaxy Event” at 9 p.m. on Aug. 27 to introduce the new product. The industry expects the Galaxy S26 Fan Edition (FE) model to be revealed. Leaked information suggests specifications including a 6.7-inch display, Exynos 2500 processor and a 4,900 mAh battery.

AI & Enterprise

NHN Dooray supplies collaboration tool to Ulsan education office

NHN Dooray said on Monday it supplied its all-in-one collaboration tool Dooray to the Ulsan Metropolitan Office of Education. The office has operated Dooray under the name USEUP since July 1. The company said it was the first case of a provincial education office adopting a software-as-a-service-based collaboration tool. The office aims to streamline reporting and cut printed documents to build a paperless education administration environment.