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Industry

AI chip glass substrate supply chain race enters round two, expands into materials alliances

Competition over glass substrates, a next-generation semiconductor packaging material, is shifting from individual company technology validation to a race to build supply chains led by materials alliances. Samsung Electro-Mechanics has moved to set up a 480 billion won joint venture with a Sumitomo Chemical group affiliate. The move sharpens its rivalry with SKC, whose unit Absolics has completed construction of a glass substrate mass-production line in Georgia.

Industry

JNTC steps up global supply chain for TGV glass substrates

JNTC, which is seeking to take an early lead in the glass substrate market, has built a commercialisation cooperation framework with Japanese semiconductor packaging company TOPPAN. The company said it signed an agreement to commercialise TGV glass substrates, a technology that drills holes in glass substrates to pass electrical signals for next-generation semiconductor packaging. JNTC said the deal follows its recent development of TGV glass substrates across 0.3 mm to 2.0 mm thicknesses and supports broader supply-chain expansion.

Industry

Samsung Electro-Mechanics to set up glass substrate JV with Japan\'s Sumitomo

Samsung Electro-Mechanics is moving to secure an early foothold in the glass substrate market for next-generation semiconductor packaging materials. The company said it signed a definitive agreement on July 2 to establish a joint venture with Dongwoo Fine-Chem, a wholly owned unit of Japan\'s Sumitomo Chemical Group, to produce the core glass substrate material known as glass core. The new venture, named GlaSSEM, will be based in Pyeongtaek, South Korea.