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Industry

As AI chips grow, packaging substrates shift from round wafers to square panels

As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.

Industry

Samsung Electro-Mechanics, LG Innotek face off over next-generation substrates at KPCA

Samsung Electro-Mechanics and LG Innotek are unveiling new semiconductor package substrate technologies at KPCA Show 2026 in Incheon from Sept. 9 to 11. Samsung Electro-Mechanics is exhibiting five items including 2.5D and 2.1D package substrates, glass substrates and automotive FCBGA. LG Innotek is debuting an AI accelerator FC-BGA and plans mass production of high value-added FC-BGA for AI training and inference in 2027. Both are accelerating glass substrate development.

Industry

SKC to inject 281 billion won into Absolics to speed glass substrate commercialisation

SKC said on Thursday its board approved a 281 billion won cash investment in Absolics by participating in a shareholder rights offering. SKC will acquire 192,416 new shares allocated in line with its 70.05 percent stake. The investment follows SKC’s 1.17 trillion won rights issue in the first half of this year, when it said it would invest 590 billion won over three years in its glass substrate business.