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Telecommunications & Media

Huawei unveils tri-fold phone with new chip, breaking through U.S. EUV curbs?

Huawei launched its new tri-fold phone Mate XT 2 in China, featuring the Kirin 9050 Pro mobile chip designed with its “tau scaling law” and the HarmonyOS 7 operating system. The phone starts at 19,999 yuan and goes on sale from Sept. 10. Huawei said overall performance rises 42% from the previous model. The device adopts an in-folding structure and adds an optional privacy OLED display.

Industry

Samsung Electronics bets on zHBM by stacking memory on accelerators

Samsung Electronics is preparing a two-track strategy of conventional HBM5 and its zHBM concept as it seeks to regain leadership in high-bandwidth memory. The company is shifting to a design that stacks HBM directly on top of AI accelerators, removing the interposer that links logic and memory side-by-side. Samsung targets 230 percent higher bandwidth and 70 percent lower power than HBM4E. Commercialisation will hinge on heat management and wafer hybrid-bonding yields.

Industry

Smartphone, PC costs to rise 15 to 40 percent in vicious cycle from commodity DRAM shortage

Memory makers are allocating more wafer capacity to high-bandwidth memory and DDR5, reducing output of commodity DRAM and lifting prices, an industry source said. The shift is expected to raise the cost of making a smartphone or PC by at least 15 to 40 percent this year. As higher costs are hard to pass on amid weak demand and falling shipments, pressure is likely to move to parts and materials suppliers.