Search results for Stacks
AI & Enterprise
KT steps up financial sector AX, pledges to prove AI adoption results with numbers
KT said it will lower barriers to AI transformation in the financial sector by combining its know-how with finance-focused AI solutions, data and cloud capabilities, and consulting. It aims to support the full process from strategy to build and operations, moving beyond proof-of-concept projects to changes in real work and management results. KT said it won more than 20 AX projects in the financial sector in the first half of this year.
Industry
SK to expand AI chip, data centre ties with five big tech firms
SK has secured a foundation to carry out its domestic AI infrastructure investment plans through cooperation with U.S. big tech companies. It agreed with Nvidia, Microsoft and Anthropic on cooperation in AI chips and AI data centres, and discussed expanding domestic AI infrastructure cooperation with Amazon Web Services. SK also plans long-term cooperation with Nvidia on AI memory, and SK hynix will pursue supplying server memory to data centres with Microsoft.
Industry
Samsung Electronics to supply 2nm foundry and HBM to Broadcom
Samsung Electronics has begun large-scale cooperation with Broadcom in the AI semiconductor infrastructure market. Samsung said it signed a strategic memorandum of understanding with Broadcom at an AI Summit in San Francisco on July 24 local time to build next-generation AI infrastructure. The companies plan cooperation worth more than $200 billion through 2030 across memory, foundry and advanced packaging. Samsung will supply HBM, including HBM4 and HBM4E, and apply processes of 2 nm or below for key Broadcom chips.
-
Industry
HBM4 thickness rule eased, MR-MUF and TC-NCF upgrade race enters new phase
-
Industry
Micron breaks ground on $9.3 billion HBM plant expansion in Hiroshima, Japan
-
AI & Enterprise
Qualcomm unveils \'High Bandwidth Compute\' as HBM alternative, enters AI chip race
-
Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
-
AI & Enterprise
Database firms push data tech to cut token waste by AI agents
-
Mobility
Slate switches to Gotion LFP battery from SK On NMC, keeps price and boosts range
-
Industry
Samsung, SK consider semiconductor cluster in Gwangju, South Jeolla with up to 400 trillion won investment
-
Crypto
Circle releases USDC spec for machine payments protocol, targeting AI agent payments
-
Crypto
Saylor unveils five-tier plan to build deposits, yield products and stocks on bitcoin
-
Industry
Samsung Electronics\' turnkey strategy aims to reverse market share in HBM4
-
Telecommunications & Media
IMEC 6G chip platform draws attention as Nvidia eyes telecoms as next AI frontier
-
Columns
Corporate AI shift: One AI agent is not enough
-
Industry
Applied Materials launches new tools to improve AI chip performance
-
Industry
China\'s EDA industry joins Huawei\'s Tau Scaling 3D chip push; commercialisation seen 4 to 5 years away
-
AI & Enterprise
AI full-stack self-reliance is an illusion; focus investment on models and cloud, report says