SK Hynix's U.S. back-end investment is entering the groundbreaking stage. SK Hynix said it will hold a groundbreaking ceremony at 11 p.m. on Aug. 27 Korea time at Purdue University in Indiana for an advanced packaging production base for AI memory. The ceremony will be attended by CEO Kwak Noh-jung (곽노정) and other key SK Group executives, as well as key Indiana officials. The company plans to livestream the event on YouTube.

The production base that will break ground is located in West Lafayette, Indiana. Advanced packaging for AI memory will be carried out there. Advanced packaging, a back-end process technology that stacks and connects multiple chips into a single product, determines AI memory performance. The investment 규모 is $3.87 billion, about 5.4 trillion won. The start of mass production is scheduled for the second half of 2028.

The Indiana plant will serve as both a production and research and development hub and will also 추진 future technology development, the company said. West Lafayette, home to Purdue University, is considered a favorable area for securing research personnel.

U.S. government support is also one of the reasons Indiana was selected as the plant site. The U.S. Department of Commerce announced in 2024 that it signed a non-binding preliminary memorandum of terms with SK Hynix to provide up to $450 million in federal incentives. The amount of direct subsidies was later set at $458 million.

SK Hynix will build Cheongju P&T7 and the Indiana advanced packaging plant at the same time. It plans to establish global integrated manufacturing capabilities spanning front-end and back-end processes.