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Industry

AMAT says AI chip performance hinges on data movement, solution is 3D scaling

Applied Materials says efficiency in moving data, rather than computing speed, is the main bottleneck for AI semiconductor performance and that the industry solution is 3D scaling. It described 3D scaling across logic, memory and packaging, and said capacity expansion should accompany demand. The company detailed approaches for DRAM, a shift in HBM stacking from micro-bumps to hybrid bonding, and panel interposer development, while highlighting cooperation with Samsung Electronics and SK Hynix in Korea.

Fintech

NH NongHyup Bank pilots \'AI Smart Pad\' at 100 branches nationwide

NH NongHyup Bank has piloted an integrated authentication terminal, the \'AI Smart Pad\', at 100 branches nationwide, using AI facial authentication technology. The bank said on Aug. 24 the rollout aims to improve customer convenience and strengthen security. The device upgrades PIN pad password entry functions and verifies customer identity in face-to-face transactions requiring real-name checks. It also includes a universal scanner that recognises various ID formats, including passports.

AI & Enterprise

KT accelerates companywide system overhaul with \'Next IT\' shift to AI native

KT said on Sunday it will accelerate companywide IT modernisation to strengthen information security and service stability and to lay the groundwork for executing its strategy as an AI transformation platform company. Under its \'Next IT\' strategy, KT will expand the scope of core system upgrades across platforms, infrastructure and the work environment and shift step by step to an AI-native next-generation IT framework. The plan spans platform modernisation, next-generation infrastructure and AI-driven work methods.