Applied Materials has selected Broadcom as an EPIC innovation partner and will move to jointly develop next-generation AI chip packaging technology. The companies said on May 21 they will use Applied's global innovation center network to strengthen advanced packaging technology for connecting multiple chips within computing systems. EPIC, short for Equipment and Process Innovation and Commercialization, is Applied's ecosystem collaboration platform that supports the full process from semiconductor technology development to commercialisation.

As demand for AI spreads and the need rises for high-performance and high-efficiency computing infrastructure, chipmakers and system design companies are actively adopting heterogeneous integration technology for multiple chips. The industry is pushing to develop new packaging technology to raise interconnect density and bandwidth for next-generation systems. The partnership is a collaboration structure aimed at meeting such technology demand.

Gary Dickerson (게리 디커슨), chairman and CEO of Applied Materials, said the EPIC platform was designed to drive joint innovation across the ecosystem to change how semiconductor technology is developed and commercialised. He said leading system design companies such as Broadcom can gain early access through EPIC to foundational innovations in materials and process equipment. He said close cooperation based on that could speed adoption of next-generation advanced packaging technology.

Charlie Kawwas (찰리 카와스), president of Broadcom's Semiconductor Solutions Group, said close cooperation with partners across the supply chain is essential to realise next-generation high-performance AI systems. He said combining Applied's materials engineering expertise and Broadcom's semiconductor and system design capabilities would allow new innovations in AI to be brought to market faster.