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Industry

Design houses move from outsourced chip design to AI chip architecture

Design house (DSP) companies that once focused on outsourced semiconductor design are expanding in both contract pricing and funding scale as AI chip mass production becomes harder with foundry steps alone after 2-nanometre nodes. With physical limits nearing, 2.5D and 3D stacking and chiplets are becoming key, making advanced packaging and interconnect new battlegrounds. Firms are shifting toward integrated design platforms and infrastructure architecture partnerships, alongside rising high-value project shares and larger financings.

Industry

TSMC dominance shows cracks, boosting Samsung foundry opportunity

The foundry market is entering a new phase as TSMC’s grip shows signs of weakening amid advanced packaging bottlenecks, opening room for rivals. Counterpoint Research said global foundry revenue rose 16 percent last year to $320 billion on steady AI chip demand. It expects TSMC’s share to slip this year, with Samsung and SMIC moving in. Samsung is pushing 2-nanometre production, while SMIC expands capacity and Intel seeks large AI customers.

Industry

ADTechnology to target edge and sovereign CPU design market

ADTechnology said it will shift from a traditional design house model based on customer drawings to proactively proposing AI server chip architectures. CEO Joon-kyu Park said the company will move from a passive approach to an active model of proposing needed architectures and co-developing them with clients. It aims to reach 1.5 trillion won in revenue by 2030 and plans to target demand for ARM-based CPUs for edge servers and sovereign environments.