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As AI chips grow, packaging substrates shift from round wafers to square panels

As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.

AI & Enterprise

World open-sources ProveKit zero-knowledge proof toolkit used in World ID

World said on Sept. 7 it has open-sourced ProveKit, a zero-knowledge proof toolkit that can verify age, nationality or valid ID possession without disclosing personal information. The company said it has opened to external developers the technology used in World ID, its “Proof of Human” system, and expects developers to build privacy-preserving identity checks into apps and services. ProveKit processes proofs on users’ devices rather than external servers.

AI & Enterprise

Shopify COO calls for X-shaped talent in AI era

In the AI era, workers who can quickly gain expertise across multiple fields may be more competitive than specialists in a single area, an opinion article said. Shopify Chief Operating Officer Jess Hertz introduced the idea of “X-shaped talent,” an expansion of the traditional T-shaped model. She said AI can help employees cross job boundaries and operate in several areas. Shopify has already reflected AI use in its HR and work systems.