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Industry

[Snapdragon Summit 2026] \"A chip like a racing engine... Move memory to the side to secure a heat-dissipation path\"

Qualcomm applied a new package design to the Snapdragon 8 Elite Extreme Gen 6 by moving memory to the side and creating a new path to dissipate heat, aiming to sustain high burst performance longer in top-end smartphones. Chris Patrick (크리스 패트릭) said keeping the SoC cool helps it stay at maximum performance longer. Qualcomm said handset makers may need minor cooling design changes and it is reviewing other packaging approaches.

Industry

CXMT, YMTC supply push may reshape DRAM and NAND market

China\'s ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are expanding production capacity using funds raised through initial public offerings, a move expected to affect the commodity memory market led by Samsung Electronics and SK Hynix. Industry estimates show CXMT and YMTC capacity rising sharply through 2028, with CXMT posting strong revenue and profit. Analysts expect further share gains, while Korean makers respond with process transitions.

Telecommunications & Media

Apple\'s first foldable \'iPhone Ultra\' may be coming; six key points

Apple may unveil its first foldable iPhone this autumn under the name iPhone Ultra, with changes spanning design, hardware and software, a report said. The device is expected to use a book-style fold with a wider outer display and an inner screen closer to an iPad mini. It may minimise screen creases, drop a telephoto camera, add iOS 27 foldable features, use an A20 Pro chip and adopt Touch ID.