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Samsung Electronics' turnkey strategy aims to reverse market share in HBM4

Samsung Electronics is moving to counter rivals in the next-generation high-bandwidth memory market by bringing base die production in-house. As HBM4 increasingly requires foundry processes on the base die, Samsung is highlighting its ability to combine design, foundry and packaging in a turnkey approach. The company has signed an MOU with AMD for primary HBM4 supply and is discussing broader cooperation with Nvidia, while challenges such as wafer warpage and low yields remain.

AI & Enterprise

Genians wins global certification for EDR solution

Genians said on Tuesday it won final certification in a 2026 EDR detection verification test conducted by AV-Comparatives, a global security product performance evaluation organisation. The company said certification requires proving uninterrupted detection visibility across at least two-thirds of the attack chain and demonstrating contextualisation that links isolated events across different infrastructure. It also said alert noise must be controlled in no more than three of five false-positive scenarios.

Telecommunications & Media

SK Telecom bets on 'AI factory' with Nvidia to push into AI infrastructure

SK Telecom is stepping up its push into the AI infrastructure market through cooperation with Nvidia, with plans to run an Nvidia DSX-based “AI factory” next year and later expand it to gigawatt scale. SK Telecom aims to combine SK Broadband’s data centre operations with Nvidia GPUs, networks and software. It also highlights its AI full-stack capabilities, while industry sources point to power supply, investment costs and customer demand as challenges.