Tesla is pushing into modular artificial intelligence data centre hardware after filing a trademark for “Megapod” in the United States. The application describes a modular data centre hardware system for AI computing, including servers, networking equipment, power distribution and cooling. Tesla also describes a self-contained modular computing unit with downloadable software for monitoring and optimisation. The move would put Tesla into competition with Nvidia-backed platforms, while Tesla remains a major Nvidia customer and has faced delays in its own AI chip plans.

As AI drives a surge in data-centre power consumption, U.S. startup Fervet has unveiled a next-generation liquid cooling solution inspired by heat management in nuclear power plants. Its adaptive phase-change cooling immerses servers in a special liquid and uses tiny boiling bubbles on chip surfaces to remove heat faster. The company says the system avoids PFAS, uses modular server-level design and improved computing power efficiency in tests with UCLA researchers.