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Tokyo University unveils next-generation semiconductor device 1,000 times faster without heat

A University of Tokyo research team has developed a next-generation semiconductor device that can raise information-processing speed by up to 1,000 times while barely increasing heat generation. The device records data using electrons’ magnetic properties rather than electric current, processing 1-bit information in about 40 picoseconds. Researchers said it also lowers heat, improves durability and could cut power use to one-hundredth if implemented in real chips, though commercialisation will take time.

Telecommunications & Media

LG Hellovision holds AI agent hackathon, identifies 83 practical tasks

LG Hellovision said on Tuesday it has completed an artificial intelligence agent hackathon joined by 203 employees. The event ran for a month in April and tested tasks for on-the-job use using generative AI, including optimising sales routes, generating local channel news articles, organising fax reception data and analysing customer inquiries. A total of 83 tasks were submitted, with eight selected as award winners.

Telecommunications & Media

Apple set to roll out four more Mac models this year as lineup shifts

Apple is expected to expand its Mac lineup over the rest of this year, with attention focused on its year-end product strategy. A report said Apple, after unveiling some new Macs already, could introduce at least four more models by the end of the year, potentially bringing total launches to as many as five. Expected updates include a Mac Studio with M5 Max and M5 Ultra chips, an M5-based iMac, and a Mac mini with M5 and M5 Pro options.