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Industry

Foundry chip market shifts from shrinking nodes to packaging as stacking and chiplets become battleground

The semiconductor industry is shifting its technology race from shrinking process nodes to packaging as scaling approaches physical limits. Companies are increasingly relying on 2.5D and 3D stacking and chiplets to meet performance, power and bandwidth demands, driving changes across the value chain that includes IP, libraries and EDA tools. Memory makers SK hynix and Samsung Electronics are advancing their packaging technologies. Intel has also demonstrated GaN-on-silicon chiplet technology and integration with silicon digital control circuits.

Industry

Samsung Electronics activates three pillars of AI growth drivers

Samsung Electronics on March 18 set out its 2026 business strategy around three pillars: semiconductors, devices and robots, aiming to accelerate a shift to an AI-centered structure. It highlighted an IDM advantage spanning memory, foundry, logic design and packaging, and presented plans for memory, foundry and System LSI. At Nvidia GTC 2026, it unveiled an HBM4E chip and packaging. It also outlined plans to double Galaxy AI devices and move robots into deployment.

Industry

Jensen Huang visits Samsung booth, picks HBM4 and Groq LPU supply chain

Nvidia CEO Jensen Huang visited Samsung Electronics\' booth at GTC 2026 in San Jose and reviewed products spanning next-generation high-bandwidth memory, server memory modules and storage, Samsung said on March 17. Huang signed Samsung\'s HBM4 core die wafer and a 4-nanometre wafer for Groq LPU foundry production. Samsung also unveiled HBM4E and hybrid copper bonding, while highlighting memory and storage solutions for Nvidia\'s Vera Rubin platform.