Search results for HBM4E
Industry
Samsung Electronics bets on zHBM by stacking memory on accelerators
Samsung Electronics is preparing a two-track strategy of conventional HBM5 and its zHBM concept as it seeks to regain leadership in high-bandwidth memory. The company is shifting to a design that stacks HBM directly on top of AI accelerators, removing the interposer that links logic and memory side-by-side. Samsung targets 230 percent higher bandwidth and 70 percent lower power than HBM4E. Commercialisation will hinge on heat management and wafer hybrid-bonding yields.
Industry
Nvidia unveils NVHBM to design HBM controller in-house
Nvidia will bring high-bandwidth memory control circuitry into its own design with NVHBM, adding the technology to its NVLink Fusion interconnect, it said on Aug. 26. The company said it will set a standard implementation and have major memory partners validate and supply it. Nvidia said integrating a custom controller into the HBM base die can boost bandwidth up to 30 percent and cut HBM power use 15 percent, while freeing up to 25 percent die area on the XPU.
Industry
Post-HBM paths diverge as Samsung stacks and SK hynix connects
Samsung Electronics and SK hynix are pursuing different approaches for the next step after high-bandwidth memory, as rising AI workloads make it hard to expand bandwidth and capacity with HBM alone. Samsung is focusing on 3D vertical stacking that places HBM on top of accelerators to reduce data-movement bottlenecks. SK hynix is standardising high-bandwidth flash with SanDisk, linking different memory tiers via UCIe to raise system capacity and efficiency.
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Industry
Samsung Electronics unveils first 400-plus-layer V10 BV-NAND
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Industry
Samsung Electronics\' chip unit makes up 99.7 percent of company operating profit
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Industry
Samsung Electronics posts record Q2 operating profit, up 1,814 percent year on year
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Industry
SK Hynix wraps up LTA talks with about 10 customers including core clients, negotiating 2027 volumes and prices
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Industry
SK Hynix Q2 operating profit 60.5 trillion won, up 557 percent on year
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Industry
SK $500 billion, Samsung $200 billion: global AI deals unveiled
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Industry
Samsung Electronics to supply 2nm foundry and HBM to Broadcom
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Industry
HBM4 thickness rule eased, MR-MUF and TC-NCF upgrade race enters new phase
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Industry
SK hynix set to raise up to 43 trillion won from Nasdaq ADR listing
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Industry
Samsung Electronics posts record quarterly operating profit above 89 trillion won, 400 trillion won annual target in focus
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Industry
Micron breaks ground on $9.3 billion HBM plant expansion in Hiroshima, Japan
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Finance
SK Hynix to list Nasdaq ADR on July 10, raise 32.7 billion won
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Industry
SK hynix supplies 12-layer HBM4E samples to key customers
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Industry
Samsung Electronics\' turnkey strategy aims to reverse market share in HBM4
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AI & Enterprise
Jensen Huang wraps up South Korea visit, stresses physical AI cooperation and startup support