Search results for HBM4E
Industry
SK $500 billion, Samsung $200 billion: global AI deals unveiled
Around a San Francisco AI summit, South Korea unveiled government-led cooperation plans between global AI companies such as Nvidia, OpenAI and Broadcom and Korean firms including Samsung Electronics, SK Group, Hyundai Motor Group and Naver. Nvidia and SK Group disclosed a partnership intent worth more than $500 billion, while Samsung and Broadcom signed an MOU worth more than $200 billion through 2030. Nvidia and Brookfield also plan a $10 billion investment in Naver.
Industry
Samsung Electronics to supply 2nm foundry and HBM to Broadcom
Samsung Electronics has begun large-scale cooperation with Broadcom in the AI semiconductor infrastructure market. Samsung said it signed a strategic memorandum of understanding with Broadcom at an AI Summit in San Francisco on July 24 local time to build next-generation AI infrastructure. The companies plan cooperation worth more than $200 billion through 2030 across memory, foundry and advanced packaging. Samsung will supply HBM, including HBM4 and HBM4E, and apply processes of 2 nm or below for key Broadcom chips.
Industry
HBM4 thickness rule eased, MR-MUF and TC-NCF upgrade race enters new phase
Competition over sixth-generation high-bandwidth memory HBM4 is shifting after JEDEC eased the HBM package thickness limit to about 775 micrometers from 720. The added margin revives options to refine bump-based processes such as MR-MUF and TC-NCF, potentially delaying hybrid bonding to HBM4E or later. Supply-chain effects are emerging, including Unitest’s contract to supply SK hynix with HBM4 wafer testers worth 22.68 billion won.
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Industry
SK hynix set to raise up to 43 trillion won from Nasdaq ADR listing
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Industry
Samsung Electronics posts record quarterly operating profit above 89 trillion won, 400 trillion won annual target in focus
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Industry
Micron breaks ground on $9.3 billion HBM plant expansion in Hiroshima, Japan
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Finance
SK Hynix to list Nasdaq ADR on July 10, raise 32.7 billion won
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Industry
SK hynix supplies 12-layer HBM4E samples to key customers
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Industry
Samsung Electronics\' turnkey strategy aims to reverse market share in HBM4
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AI & Enterprise
Jensen Huang wraps up South Korea visit, stresses physical AI cooperation and startup support
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Industry
Jensen Huang charts AI cooperation map in South Korea over four days
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Industry
Samsung foundry pins hopes on \'AI factory\' turnkey model to chase TSMC
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Finance
Samsung Electronics opens 2,000 trillion won market cap era, closes in on bitcoin
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Industry
Samsung Electronics first ships HBM4E 12-layer samples to global customers
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AI & Enterprise
National Growth Fund bets 800 billion won on FuriosaAI, backs SK Bioscience too
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Industry
HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view
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Industry
China-led low-spec HBM front expands, raising concerns over impact on Korean memory profits
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Industry
GPU standalone era may end as integrated design determines AI chip performance