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Fadu unveils Gen6 controller, FlexSSD at China flash market summit

Data centre semiconductor company Fadu took part in CFMS 2026 in Shenzhen and unveiled its next-generation Gen6 controller and FlexSSD platform, it said on Monday. The company said it used an exhibition booth and a keynote speech to market to local potential customers such as cloud service providers, module makers and server companies. It also showcased its Gen5 controller, which it is supplying to global CSP and OEM customers.

Industry

Jensen Huang visits Samsung booth, picks HBM4 and Groq LPU supply chain

Nvidia CEO Jensen Huang visited Samsung Electronics\' booth at GTC 2026 in San Jose and reviewed products spanning next-generation high-bandwidth memory, server memory modules and storage, Samsung said on March 17. Huang signed Samsung\'s HBM4 core die wafer and a 4-nanometre wafer for Groq LPU foundry production. Samsung also unveiled HBM4E and hybrid copper bonding, while highlighting memory and storage solutions for Nvidia\'s Vera Rubin platform.

Industry

Samsung Electronics unveils first physical HBM4E chip at GTC

Samsung Electronics unveiled its next-generation HBM4E physical chip for the first time at Nvidia GTC 2026 in San Jose, California. The company said it is showcasing an HBM4E chip and core-die wafer developed using its 1c DRAM process and a foundry 4-nanometre base die. It also introduced Hybrid Copper Bonding packaging technology and displayed memory and storage products for Nvidia’s Vera Rubin platform. An executive is scheduled to present on March 17.