As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.

Krafton is seeking to reinvent itself as a company that discovers and develops fun games, with a strategy to foster promising titles into franchises regardless of genre or IP. At Gamescom 2026 in Cologne, it unveiled five new games spanning multiple genres and development approaches. The company says it is pursuing a publishing strategy built on challenging genre conventions, working with external studios and reinterpreting existing franchises, while strengthening a repeatable system to find, validate and scale up franchise IP.