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SK Hynix speeds up memory timeline as fab infrastructure moves ahead

SK Hynix is accelerating construction of memory-related infrastructure, with its first Yongin fab nearing completion and investment and groundbreaking dates set for additional fabs. The company plans to hold a groundbreaking ceremony in Indiana for a $3.9 billion advanced packaging plant. It has decided to invest 35.2 trillion won in Yongin’s Y2 fab and 19.1 trillion won in Cheongju’s M17. The government has also moved to speed up power-grid schedules for the Honam semiconductor cluster.