Search results for JEDEC
Industry
Samsung Electronics, SK Hynix diverge on long-term memory contract strategy
Samsung Electronics and SK Hynix are shifting memory sales to multi-year long-term supply agreements, but are taking different approaches. Samsung is seeking to lock in 60 to 70 percent of capacity under contracts that fix price and volume. SK Hynix is building up deals but keeping part of output outside contracts, citing supply constraints. With terms undisclosed, the outcome is expected to be judged by earnings and shareholder returns.
Industry
HBM4 thickness rule eased, MR-MUF and TC-NCF upgrade race enters new phase
Competition over sixth-generation high-bandwidth memory HBM4 is shifting after JEDEC eased the HBM package thickness limit to about 775 micrometers from 720. The added margin revives options to refine bump-based processes such as MR-MUF and TC-NCF, potentially delaying hybrid bonding to HBM4E or later. Supply-chain effects are emerging, including Unitest’s contract to supply SK hynix with HBM4 wafer testers worth 22.68 billion won.
Industry
Samsung Electronics develops industry\'s first UFS 5.0, mass production in fourth quarter
Samsung Electronics said on Monday it has developed the industry\'s first UFS 5.0, the latest embedded memory standard from JEDEC, as on-device AI boosts demand for faster storage. The product is based on the company’s ninth-generation V-NAND and supports sequential read speeds of 10.8 GB/s and write speeds of 9.5 GB/s, about double UFS 4.1. Samsung said power efficiency improves by more than 40 percent and mass production will start in the fourth quarter.
