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Industry
Samsung Electronics develops industry\'s first UFS 5.0, mass production in fourth quarter
Samsung Electronics said on Monday it has developed the industry\'s first UFS 5.0, the latest embedded memory standard from JEDEC, as on-device AI boosts demand for faster storage. The product is based on the company’s ninth-generation V-NAND and supports sequential read speeds of 10.8 GB/s and write speeds of 9.5 GB/s, about double UFS 4.1. Samsung said power efficiency improves by more than 40 percent and mass production will start in the fourth quarter.
Industry
Samsung Electronics begins mass production shipments of HBM4, sees HBM sales tripling in 2026
Samsung Electronics said on Feb. 12 it has begun mass production shipments of HBM4, calling it the world’s first for next-generation high-bandwidth memory. It said HBM4 reaches 11.7 Gbps, 46 percent above the JEDEC standard, with power efficiency improved 40 percent from the prior generation. Samsung forecasts 2026 HBM sales will rise more than threefold from 2025. It plans to expand HBM4 capacity and ship HBM4E samples in the second half of 2026.
Industry
Custom HBM era raises uncertainty over supply chain information
Uncertainty is growing around the next-generation high bandwidth memory (HBM) market as HBM4 moves toward customer-optimised custom products, reducing information transparency. With key specifications and timelines shared mainly between customers and manufacturers, supply chain visibility has narrowed. Industry sources say HBM4 also requires three-way cooperation among fabless designers, foundries and memory makers. SK Hynix says HBM4 is proceeding as scheduled and inventories will fall further in the second half of 2026.