Search results for Hybrid bonding
Industry
Justem secures 30 billion won semiconductor policy funding from KDB
Justem has secured 30 billion won in semiconductor policy funding from the Korea Development Bank to speed construction of a third plant and expand research and development investment, it said on May 18. The financing is a fiscal-linked fund that KDB provides for facility investment to strengthen semiconductor manufacturing capabilities. Justem said it obtained the funding at an ultra-low interest rate with a 10-year repayment term.
Industry
Dutch chip equipment maker Besi sees surge in hybrid bonding orders on AI infrastructure investment
Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posted strong quarterly results, benefiting from expanding investment in AI infrastructure. Besi recorded first-quarter revenue of 185 million euros and net profit of 52 million euros, according to a recent report by Techzine. Its order backlog rose and beat analysts\' forecasts, more than doubling on an annual basis. CEO Richard Blickman highlighted particularly strong demand for hybrid bonding systems.
Industry
Lam Research, Applied Materials consider acquiring Dutch chip equipment maker BESI
Dutch chip equipment maker BE Semiconductor Industries (BESI) has emerged as a potential acquisition target for major U.S. chip equipment companies. Lam Research and Applied Materials are reported to be considering a takeover. Reuters reported talks began in mid-2025, were paused early this year amid geopolitical tensions between the United States and the European Union over Greenland, and have recently resumed. BESI has selected Morgan Stanley as adviser and says it will remain independent.
