| Mobile Web

Search results for Hybrid bonding

Industry

SK Hynix wraps up LTA talks with about 10 customers including core clients, negotiating 2027 volumes and prices

SK Hynix has completed negotiations on long-term supply agreements with about 10 customers, including core clients, it said. The contracts typically run five years and include financial arrangements such as deposits alongside purchase commitments. The company said tight memory supply-demand conditions are likely to persist, supporting customers’ push for mid- to long-term supply stability. It is also negotiating 2027 HBM supply volumes and prices with key customers.

Industry

HBM4 thickness rule eased, MR-MUF and TC-NCF upgrade race enters new phase

Competition over sixth-generation high-bandwidth memory HBM4 is shifting after JEDEC eased the HBM package thickness limit to about 775 micrometers from 720. The added margin revives options to refine bump-based processes such as MR-MUF and TC-NCF, potentially delaying hybrid bonding to HBM4E or later. Supply-chain effects are emerging, including Unitest’s contract to supply SK hynix with HBM4 wafer testers worth 22.68 billion won.

Industry

Semiconductor boom, but South Korea\'s chip equipment exports to China fall

South Korea\'s semiconductor exports rose past $40 billion for the first time on a monthly basis, extending a 16-month streak of gains. But exports of semiconductor manufacturing equipment to China edged down in June even as memory chip shipments surged. The article points to China focusing on domestically made back-end processing equipment as the United States tightens controls on advanced lithography tools. Hybrid bonding and other back-end processes are highlighted as key areas of Chinese localisation.