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Industry

Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields

Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memory and 3D stacking. The lineup includes CMP, electrochemical deposition and PECVD systems, two e-beam metrology tools, and an upgraded epitaxy system for DRAM peripheral transistors.

Industry

HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view

As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.

Industry

Justem secures 30 billion won semiconductor policy funding from KDB

Justem has secured 30 billion won in semiconductor policy funding from the Korea Development Bank to speed construction of a third plant and expand research and development investment, it said on May 18. The financing is a fiscal-linked fund that KDB provides for facility investment to strengthen semiconductor manufacturing capabilities. Justem said it obtained the funding at an ultra-low interest rate with a 10-year repayment term.