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Industry

Applied Materials, BE Semiconductor Industries expand EPIC Center cooperation for AI packaging

Applied Materials said on Thursday it will expand its strategic partnership with BE Semiconductor Industries, with BESI joining Applied\'s EPIC Center as an innovation partner. The companies plan to widen cooperation beyond their joint development program launched in 2020 to cover new interconnect structures and applications. They will jointly optimise process and assembly solutions across advanced packaging, from wafer-level hybrid bonding to panel-scale integration, aiming to deliver jointly optimised results to customers earlier.

Industry

Samsung Electronics bets on zHBM by stacking memory on accelerators

Samsung Electronics is preparing a two-track strategy of conventional HBM5 and its zHBM concept as it seeks to regain leadership in high-bandwidth memory. The company is shifting to a design that stacks HBM directly on top of AI accelerators, removing the interposer that links logic and memory side-by-side. Samsung targets 230 percent higher bandwidth and 70 percent lower power than HBM4E. Commercialisation will hinge on heat management and wafer hybrid-bonding yields.

AI & Enterprise

LG to hold \'LG Spark 2026\' in Magok, unveil new Physical AI and AIDC technologies

LG will hold \'LG Spark 2026\' at LG Sciencepark in Magok, Seoul, from Sept. 7 to 17, it said on Thursday. The event will run five programs focused on spreading AI innovation and transformation cases. LG will showcase 41 new R&D technologies, including Physical AI, AIDC and mobility. It will also present 68 AX cases, share Exaone applications and plans, hold a developer conference with global firms, and run mentoring and experience programs for students.