Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posts an impressive quarterly scorecard as investment in AI infrastructure expands.
A recent report by Techzine said Besi records first-quarter revenue of 185 million euros and net profit of 52 million euros.
Its order backlog also rises, beating analysts' forecasts by a wide margin. On an annual basis, the order backlog more than doubles.
Besi CEO Richard Blickman (리처드 블릭만) says demand for hybrid bonding systems is particularly strong. Hybrid bonding is considered a key technology for next-generation AI chips because it directly connects chips through fine copper bonds to raise data exchange speeds and cut energy use.
As advanced lithography-based miniaturisation reaches its limits, chipmakers are also turning to advanced packaging, a trend that works in Besi's favour. The company forecasts revenue will rise in the second quarter and margins will improve.
Besi is also pushing to expand production capacity. In Vietnam, it is increasing output of standardised systems, while in Malaysia it is expanding capacity for AI-focused solutions. Besi is also strengthening its presence in Taiwan and South Korea. Besi is also working with TSMC and Applied Materials to develop hybrid bonding technology.
Chi-gyu Hwang
delight@d-today.co.kr