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Industry

Design houses move from outsourced chip design to AI chip architecture

Design house (DSP) companies that once focused on outsourced semiconductor design are expanding in both contract pricing and funding scale as AI chip mass production becomes harder with foundry steps alone after 2-nanometre nodes. With physical limits nearing, 2.5D and 3D stacking and chiplets are becoming key, making advanced packaging and interconnect new battlegrounds. Firms are shifting toward integrated design platforms and infrastructure architecture partnerships, alongside rising high-value project shares and larger financings.

Industry

SK Hynix to overhaul long-term supply contracts to prioritise volumes over price

SK Hynix is reviewing a new structure for long-term supply agreements, saying customers increasingly view securing volumes as a key risk. The company reported record quarterly revenue and operating profit for the first quarter of 2026 and said shortages of HBM, server DRAM and enterprise SSDs may persist, extending a price upcycle. It will bring forward the start of its Yongin cluster Phase 1 fab and accelerate NAND transitions and next-generation product rollouts.

AI & Enterprise

Phanesia to mass-produce PCIe 6.4-CXL 3.2 fusion fabric switch in second half

Korean fabless chip company Phanesia said on Wednesday it will begin mass production in the second half of this year of its PCIe 6.4-CXL 3.2 fusion switch chip for AI infrastructure. The chip implements the full CXL 3.2 standard, including port-based routing, and is a mass-production version of a silicon sample the company unveiled in October. It supports PCIe and CXL protocols on a single chip.