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Samsung Electronics unveils first physical HBM4E chip at GTC

Samsung Electronics unveiled its next-generation HBM4E physical chip for the first time at Nvidia GTC 2026 in San Jose, California. The company said it is showcasing an HBM4E chip and core-die wafer developed using its 1c DRAM process and a foundry 4-nanometre base die. It also introduced Hybrid Copper Bonding packaging technology and displayed memory and storage products for Nvidia’s Vera Rubin platform. An executive is scheduled to present on March 17.