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Industry

TI aims to push power density limits for AI data centres

Texas Instruments unveiled next-generation insulated power modules targeting data centres and the electric vehicle market. It applied its in-house IsoShield multi-chip packaging to raise power density by up to three times versus existing solutions and cut solution size by up to 70 percent. At a media briefing, TI introduced the UCC34141 and UCC14240. TI highlighted IsoShield and MagPack technologies and said the approach reduces component count and design risk.

Industry

Samsung SDI, L&F sign supply deal for China-free LFP cathode materials for U.S. ESS market

Samsung SDI and L&F agreed to build a supply chain for key battery materials outside China. The two companies said on Monday they signed a mid- to long-term supply contract for cathode materials for LFP batteries worth 1.6 trillion won. Supplies are fixed for three years from 2027 to 2029, with an option for an additional three years. Samsung SDI plans to use the materials at its Indiana joint venture to produce batteries for energy storage systems.

AI & Enterprise

MSIT invites applications for GovTech AI pilot support programme worth 3.24 billion won

South Korea's Ministry of Science and ICT said on March 24 it is inviting applications for a support programme for GovTech startups to pilot and commercialise AI services. Eligible applicants are consortia between GovTech firms that are within 7 years of founding and demand agencies such as central government bodies, local governments and public institutions. The ministry plans to support about 18 projects with a total of 3.24 billion won and provide tailored programmes by development stage.