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Intel Ohio chip plant raises first structure after five-year delay, targets 2030 completion

Intel has completed installation of the first major structural truss at its large semiconductor plant under construction in New Albany, Ohio, and has moved into the next phase of work. The project is at least five years behind the original schedule. Intel had initially said chips would begin shipping in 2025, but it now targets completion in 2030. A second plant is planned on a site northeast of Columbus, with a completion target of 2031.

Industry

LG Electronics demonstrates road-tested traffic safety solution at Gangneung ITS world congress

LG Electronics is stepping up efforts to target the global traffic safety solutions market with vehicle-to-everything communications technology aimed at reducing traffic accidents. The company demonstrated a next-generation solution through a live road-driving trial at the 2026 ITS World Congress in Gangneung, Gangwon province. The system combines V2X and V2N to warn drivers of hazards such as stopped vehicles, roadworks, bad weather, approaching ambulances and pedestrian collision risks.

Telecommunications & Media

U.S. iPhone 18 Pro Max teardown shows Qualcomm X80 modem, not Apple C2

A teardown of the iPhone 18 Pro Max sold in the United States found it uses Qualcomm\'s Snapdragon X80 modem rather than Apple\'s in-house cellular modem, 9to5Mac reported, citing TechInsights. Apple says the iPhone 18 Pro uses its C2 modem, and the iPhone 18 Pro Max sold outside the United States also uses C2. Apple has not said why the U.S. model keeps a Qualcomm modem. TechInsights also identified Apple’s N1 wireless module and a new mmWave antenna module.