Hanmi Semiconductor said on Feb. 9 it posted 576.7 billion won in 2025 revenue and 251.4 billion won in operating profit. Revenue rose 3.2 percent from a year earlier, but operating profit fell 1.6 percent. Fourth-quarter revenue was 83.0 billion won and operating profit was 27.6 billion won. From the previous quarter, revenue fell 50.1 percent and operating profit dropped 59.2 percent.

Hanmi Semiconductor posted its highest annual revenue since its founding last year. Its operating margin was 43.6 percent. Sales of manufacturing equipment for high-bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors drove the strong performance. Hanmi Semiconductor holds a 71.2 percent share of the TC bonder market, a key component for HBM.

A TC bonder is equipment that bonds memory chips under high temperature and pressure in the HBM manufacturing process. Market research firm TechInsights projected the TC bonder market will grow 13.0 percent a year on average from 2025 to 2030.

Hanmi Semiconductor plans to unveil a "wide TC bonder" for producing HBM5 and HBM6 in the second half of this year. The product is seen as equipment that fills the gap left by hybrid bonders (HB) whose mass production is being delayed. It is also preparing to launch a next-generation hybrid bonder to align with the expected start of mass production of HBM with 16 or more layers around 2029. Hanmi Semiconductor said it is consulting with customers based on the original hybrid bonder technology for HBM it developed in 2020.

It will also launch bonding equipment this year for AI system semiconductors. The equipment will be used for AI semiconductor packages that integrate HBM core dies, base dies, and GPUs and CPUs, as well as for co-packaged optics (CPO) packaging. It plans to supply the equipment to foundries and OSAT companies in China and Taiwan.

Hanmi Semiconductor is also maintaining the top market share in EMI shield equipment for the aerospace sector. The equipment is essential for space exploration rockets, low Earth orbit satellite communications (LEO) and military drones.

A Hanmi Semiconductor official said HBM demand is expected to be higher than ever due to continued growth in the AI semiconductor market and expanding investment by global semiconductor companies. The official said it will further strengthen leadership in the global semiconductor equipment market through next-generation product development and expanded production capacity.