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Industry

Design houses move from outsourced chip design to AI chip architecture

Design house (DSP) companies that once focused on outsourced semiconductor design are expanding in both contract pricing and funding scale as AI chip mass production becomes harder with foundry steps alone after 2-nanometre nodes. With physical limits nearing, 2.5D and 3D stacking and chiplets are becoming key, making advanced packaging and interconnect new battlegrounds. Firms are shifting toward integrated design platforms and infrastructure architecture partnerships, alongside rising high-value project shares and larger financings.

Industry

TSMC unveils roadmap through 2029 featuring A13, A12 and N2U processes

TSMC, the world’s largest foundry, unveiled its semiconductor process roadmap through 2029, introducing next-generation A13, A12 and N2U processes. It adjusted parts of its existing plan, pushing A16 mass production to 2027 to match key customer product schedules. The company said A13 targets a 6 percent chip area reduction while keeping design rules, and N2U aims performance and power gains. TSMC also highlighted packaging technologies including CoWoS and SoW-X.

AI & Enterprise

Intel shares surge 15 percent after hours on Q1 beat, strong Q2 outlook; data center and foundry sales rise

Intel\'s shares surged 15 percent in after-hours trading after the company posted first-quarter results that beat market expectations and issued a stronger-than-expected second-quarter outlook. Revenue rose 7.2 percent to $13.58 billion, topping forecasts. Data center revenue climbed 22 percent to $5.1 billion and foundry revenue rose 16 percent to $5.4 billion. Intel posted a net loss of $4.28 billion, wider than a year earlier.