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Industry

HBM battle lines and DRAM price direction: March semiconductor events in focus

March brings a packed global semiconductor calendar, with Nvidia’s GTC expected to outline next-generation AI chips and related high-bandwidth memory demand. China’s annual parliamentary meetings are set to unveil the 2026–2030 five-year plan, potentially detailing subsidies tied to chip self-reliance. Samsung Electronics and SK Hynix shareholder meetings may signal leadership changes and governance shifts. Investors are also watching whether DRAM and NAND contract prices turn at the end of the quarter.

Industry

Samsung Electronics taps Kim Yong-kwan as new director, nominates Huh Eun-nyoung as outside director

Samsung Electronics nominates Kim Yong-kwan, head of management strategy for its Device Solutions semiconductor division, as a new director. It will hold its 57th annual general meeting on March 18 in Suwon. The agenda includes appointing outside directors, approving financial statements, raising the directors\' pay cap and amending the articles. Seoul National University professor Huh Eun-nyoung is proposed for the audit committee. A proposal to appoint Chairman Lee Jae-yong as an inside director is not included.

Telecommunications & Media

KT succeeds in demonstration of AI-based next-generation wireless transmit-receive technology

KT said on Tuesday it succeeded in demonstrating an AI-based next-generation wireless transmit-receive technology with Qualcomm Technologies and Germany\'s Rohde & Schwarz. The technology is an AI-based channel state information compression method being pursued under 3GPP Release 20. KT said it built a test environment linking Qualcomm\'s next-generation Snapdragon mobile platform with a Rohde & Schwarz AI base-station system. KT said the demonstration improved downlink performance by about 50 percent.