Search results for ASMPT
Industry
HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view
As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.
Industry
Applied Materials to acquire ASMPT subsidiary NEXX
Applied Materials will acquire ASMPT\'s NEXX business unit to expand its advanced packaging capabilities, the company said on Wednesday. NEXX makes large-area advanced packaging deposition equipment for the semiconductor industry. The acquisition will give Applied Materials access to NEXX\'s panel-level electrochemical deposition technology. The deal is expected to close in the coming months, subject to customary conditions, and does not require separate regulatory approval.
Industry
Korean HBM equipment makers target Japan\'s semiconductor market
Japan\'s Rapidus is expected to place equipment orders ahead of the April start-up of its back-end R&D centre in Hokkaido. The centre will focus on chiplet-based advanced packaging such as FC-BGA, silicon interposers and hybrid bonding. The article says Japan is strong in front-end tools but lacks a robust back-end equipment ecosystem for HBM and 2.5D packaging, creating opportunities for Korean suppliers. It cites recent supply deals by Hanmi Semiconductor and Hanwha Semitec with SK Hynix.