Applied Materials will acquire ASMPT's NEXX business unit to expand its advanced packaging capabilities. Applied Materials said on Wednesday it signed a definitive agreement with ASMPT to acquire the NEXX business unit. NEXX makes large-area advanced packaging deposition equipment for the semiconductor industry. The acquisition will give Applied Materials NEXX's panel-level electrochemical deposition (ECD) technology. The combined companies plan to support chipmakers and systems companies in building energy-efficient, high-performance large AI accelerators.

As AI workloads increase, demand is growing for large chiplet-based designs that integrate GPUs, high-bandwidth memory (HBM) stacks and input-output (I/O) chips into a single package. As AI chip packaging evolves toward 2.5D and 3D chiplet stacking structures, demand is also rising for large interposers and advanced substrates. This trend is accelerating a shift from 300 mm silicon wafers to panel form factors of 510 by 515 mm or larger, which is advantageous for manufacturers seeking to make larger AI chips and raise output.

Applied Materials has a manufacturing portfolio spanning digital lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD), etch, and electron beam (eBeam) metrology and inspection systems. With NEXX's ECD technology added, its addressable market will also expand, the company said. On that basis, Applied Materials plans to develop co-optimized solutions for fine-pitch I/O wiring and accelerate its advanced packaging roadmap for AI chipmakers and systems companies.

The transaction is expected to be completed in the coming months, subject to customary closing conditions. No separate regulatory approval is required. After closing, the NEXX team will be integrated into Applied Materials' Semiconductor Products Group.

Prabu Raja (프라부 라자), president of Applied Materials' Semiconductor Products Group (SPG), said adding NEXX will complement and strengthen the company's leadership in advanced packaging, especially in panel processes, which will be a major opportunity for joint innovation and growth with customers over the coming years. He said he was pleased to bring NEXX's talent into Applied Materials and looked forward to opening a new chapter in advanced packaging technology with the combined customer base.

Yarek Fisera (야렉 피세라), president of ASMPT NEXX, said he was pleased to join Applied Materials and accelerate adoption of large advanced packaging technologies for the computing industry. He said NEXX products already have strong competitiveness and will continue to focus on innovation, quality and excellent customer service within Applied Materials to sustain growth.