Search results for 2.5D packaging
Industry
ADTechnology wins chiplet design order for U.S. AI datacenter chips
ADTechnology said on Monday it signed a 40 billion won turnkey contract with a U.S. AI fabless company to develop and supply chiplets for a datacenter high-performance computing system-on-chip. The company will handle the full process from design to tape-out and mass production based on Samsung Foundry\'s 4-nanometre process. The project targets an integrated SoC chiplet combining HBM and AI accelerator logic, with tape-out aimed for the fourth quarter of 2026.
Industry
Nvidia seen reverting Rubin CPX memory to HBM from GDDR7
Market expectations are growing that Nvidia could switch the memory in its next-generation AI inference accelerator, Rubin CPX, from GDDR7 back to high-bandwidth memory. The view is driven by assessments that large-scale production inference workloads require more bandwidth and capacity than GDDR7 can efficiently provide. Rising inference demand cited by CEO Jensen Huang and comments on supply constraints have added momentum. A switch would require redesign and could affect HBM supply-demand outlooks.
Industry
Korean HBM equipment makers target Japan\'s semiconductor market
Japan\'s Rapidus is expected to place equipment orders ahead of the April start-up of its back-end R&D centre in Hokkaido. The centre will focus on chiplet-based advanced packaging such as FC-BGA, silicon interposers and hybrid bonding. The article says Japan is strong in front-end tools but lacks a robust back-end equipment ecosystem for HBM and 2.5D packaging, creating opportunities for Korean suppliers. It cites recent supply deals by Hanmi Semiconductor and Hanwha Semitec with SK Hynix.