Industry

Tokyo University unveils next-generation semiconductor device 1,000 times faster without heat

A University of Tokyo research team has developed a next-generation semiconductor device that can raise information-processing speed by up to 1,000 times while barely increasing heat generation. The device records data using electrons’ magnetic properties rather than electric current, processing 1-bit information in about 40 picoseconds. Researchers said it also lowers heat, improves durability and could cut power use to one-hundredth if implemented in real chips, though commercialisation will take time.

Crypto

XRP Ledger used for tokenised government bond settlement in South Korea

Ripple's XRP Ledger (XRPL) has been used in South Korea to settle tokenised government bonds. Ripple worked with Kyobo Life Insurance to apply XRPL across issuance, settlement and custody of the bonds. The case aligns with Ripple CEO Brad Garlinghouse's recent push for onchain bond settlement and his criticism of slow, inefficient traditional systems. Market participants say the approach is already being implemented in part, including an April transaction in South Korea.