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AI & Enterprise

Intel unveils next-generation memory to challenge HBM in AI market

Intel has signalled a structural shift in the semiconductor memory market by promoting Z-angle Memory, or ZAM, a next-generation vertical-stacked memory designed to replace high-bandwidth memory. Intel is set to disclose the technology in an upcoming VLSI Conference paper. The company backs development while Japan-based Saimemory Corporation, a SoftBank subsidiary, leads commercialisation. ZAM is expected to compete with HBM4 intended for Nvidia’s next-generation AI platform.

Telecommunications & Media

Voice spam doubles in 2025 H2 after mobile handset subsidy law repeal

The Korea Communications Commission and the Korea Internet & Security Agency on May 14 released data on spam distribution in the second half of 2025. A survey of 3,000 mobile phone and email users aged 12 to 69 found average monthly spam received per person rose to 10.35 messages, up 30.8 percent from the first half. Voice spam doubled, while text spam and related reports and detections fell sharply.

Industry

April ICT exports hit $42.71 billion on semiconductor tailwinds

South Korea's information and communications technology exports in April rose 125.9% from a year earlier to $42.71 billion, while imports increased 33.3% to $16.16 billion, resulting in a $26.55 billion trade surplus. Exports stayed above $40 billion for a second straight month. Semiconductors, mobile phones, computers and peripherals, and communications equipment posted gains, while displays fell. Exports to major markets including the United States and China increased.