Search results for SiP
Industry
Samsung Electronics first ships HBM4E 12-layer samples to global customers
Samsung Electronics said on May 29 it had shipped the world’s first HBM4E 12-layer samples to global customers, months after the successful start of mass shipments of HBM4. It said HBM4E supports 14 Gbps per pin as standard and up to 16 Gbps, more than 20 percent faster than HBM4, and provides 3.6 terabytes per second of bandwidth per stack. The company said the 48 GB product offers higher capacity and improved energy efficiency and thermal resistance.
Industry
SK Hynix unveils iHBM with built-in cooling for HBM packages
SK Hynix unveiled its iHBM technology on May 26, embedding integrated cooling elements in HBM packages to secure a dedicated heat-release path. The company said the structural change can reduce thermal resistance by more than 30 percent and maintain stable operation in high-temperature, high-load conditions. It applies an advanced MR-MUF-based wafer-level packaging process and is designed for compatibility with existing SiP environments. SK Hynix plans to apply it sequentially from next-generation products such as HBM5.
Industry
LG Innotek Q1 operating profit up 136 percent on year to 295.3 billion won
LG Innotek said on April 27 it posted first-quarter revenue of 5.53 trillion won and operating profit of 295.3 billion won. Revenue rose 11.1 percent and operating profit jumped 136 percent from a year earlier, with revenue the highest ever for a first quarter. From the previous quarter, revenue fell 27.3 percent and operating profit declined 9.1 percent. The company cited solid demand and strength in high value-added semiconductor substrates.
