Industry
Hanwha Semitec showcases advanced packaging lineup at Semicon Taiwan
Hanwha Semitec will take part in Semicon Taiwan 2026 at the Nangang Exhibition Center in Taipei and introduce four advanced packaging tools, the company said on Tuesday. It will exhibit the SFM5 Square fan-out panel-level packaging tool, the SFM5 Expert 3D TC bonder, the SFM5 TnR 2.5D CoW bonder and the SHB2 Nano hybrid bonder. The SFM5 Square will be shown as a physical unit for the first time.
