Hanwha Semitec will take part in Semicon Taiwan 2026 at the Nangang Exhibition Center in Taipei and introduce four advanced packaging tools, the company said on Tuesday. Semicon Taiwan is an international exhibition where semiconductor-related companies share technology trends. This year, about 1,300 companies from around the world, including Lam Research and Tokyo Electron, will take part.

Hanwha Semitec will set up a booth on the fourth floor of Hall 1 at the Nangang Exhibition Center and display the SFM5 Square, a large-area fan-out panel-level packaging tool, the SFM5 Expert 3D TC bonder, the SFM5 TnR 2.5D CoW bonder and the SHB2 Nano hybrid bonder. Among them, the SFM5 Square will be unveiled as a physical unit for the first time at this exhibition. Unlike conventional packaging based on round wafers, it uses a 600 by 600 mm square panel to reduce corner loss area. It is seen as a next-generation packaging method that can raise production efficiency while lowering manufacturing costs.

The SHB2 Nano hybrid bonder developed by Hanwha Semitec in February is also drawing attention. Unlike conventional methods that connect chips by inserting filler between them, it directly bonds copper electrodes and insulators to eliminate gaps between chips. It enables ultra-fast data transfer by allowing chips to be stacked thinner and more densely, and is viewed as core equipment for producing HBM, a next-generation high-bandwidth memory. The company said its SFM5 Expert TC bonder used in HBM manufacturing has continued to win orders after succeeding in mass production last year.

Also being introduced, the SFM5 TnR is a CoW bonder using a chip-on-wafer method that bonds semiconductors supplied in different forms on a single tool. It can handle logic semiconductors in wafer form and HBM supplied as individual chips packaged on tape at the same time on a single tool, boosting productivity without intermediate processes. Hanwha Semitec plans to use the exhibition to expand cooperation with global semiconductor manufacturers.

A Hanwha Semitec official said, "This Semicon Taiwan will be an occasion to imprint Hanwha Semitec's equipment competitiveness on the global market in an era led by AI and high-performance packaging." The official added, "We will expand cooperation with global semiconductor customers and accelerate entry into the next-generation packaging market."