Search results for PCIe Gen6
Industry
Jensen Huang visits Samsung booth, picks HBM4 and Groq LPU supply chain
Nvidia CEO Jensen Huang visited Samsung Electronics\' booth at GTC 2026 in San Jose and reviewed products spanning next-generation high-bandwidth memory, server memory modules and storage, Samsung said on March 17. Huang signed Samsung\'s HBM4 core die wafer and a 4-nanometre wafer for Groq LPU foundry production. Samsung also unveiled HBM4E and hybrid copper bonding, while highlighting memory and storage solutions for Nvidia\'s Vera Rubin platform.
Industry
Samsung Electronics unveils first physical HBM4E chip at GTC
Samsung Electronics unveiled its next-generation HBM4E physical chip for the first time at Nvidia GTC 2026 in San Jose, California. The company said it is showcasing an HBM4E chip and core-die wafer developed using its 1c DRAM process and a foundry 4-nanometre base die. It also introduced Hybrid Copper Bonding packaging technology and displayed memory and storage products for Nvidia’s Vera Rubin platform. An executive is scheduled to present on March 17.
AI & Enterprise
Phanesia signs contract with Korean research institute for PCIe Gen6 link semiconductor technology
Phanesia, a Korean fabless company developing link solutions to improve AI infrastructure efficiency, said on Tuesday it signed a contract with a research institute for high-speed interface link semiconductor technology supporting PCIe Gen6 and completed delivery. The company said the deal relates to link semiconductors that support the PCIe Gen6 standard, which it said reflects recognition of its ultra-high-speed data transmission capabilities.
