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Industry

Intel Ohio chip plant raises first structure after five-year delay, targets 2030 completion

Intel has completed installation of the first major structural truss at its large semiconductor plant under construction in New Albany, Ohio, and has moved into the next phase of work. The project is at least five years behind the original schedule. Intel had initially said chips would begin shipping in 2025, but it now targets completion in 2030. A second plant is planned on a site northeast of Columbus, with a completion target of 2031.

Industry

TSMC supply bottleneck raises questions over AI infrastructure investment, opening for Samsung and Intel

Surging demand for AI chips is turning the production capacity of TSMC, the world’s largest foundry, into a key bottleneck for the global semiconductor industry, the article said. Big tech companies are competing to secure advanced chip output. TSMC posted record quarterly results but capacity has not kept pace with demand. Analysts warn constraints could weigh on large-scale AI infrastructure plans, while Samsung Electronics and Intel may benefit as customers look to diversify supply chains.

Finance

Shinhan Investment Corp expands cooperation with Japan, Hong Kong and Vietnam

Shinhan Investment Corp is expanding cooperation with financial institutions and capital-market related bodies in Japan, Hong Kong and Vietnam as it accelerates the building of a global investment platform. The company said its CEO Lee Sun-hoon visited the three countries to discuss cooperation on foreigner integrated accounts, wealth management and investment banking. In Hong Kong it signed an MOU with CICC International. In Vietnam it met regulators and exchange officials to discuss market cooperation and investor exchanges.