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SK Hynix unveils iHBM with built-in cooling for HBM packages

SK Hynix unveiled its iHBM technology on May 26, embedding integrated cooling elements in HBM packages to secure a dedicated heat-release path. The company said the structural change can reduce thermal resistance by more than 30 percent and maintain stable operation in high-temperature, high-load conditions. It applies an advanced MR-MUF-based wafer-level packaging process and is designed for compatibility with existing SiP environments. SK Hynix plans to apply it sequentially from next-generation products such as HBM5.