Search results for HBM3
Industry
China-led low-spec HBM front expands, raising concerns over impact on Korean memory profits
China’s memory push is moving into high-bandwidth memory, with CXMT seeking mass production of HBM3 and reallocating 20% of capacity, or 60,000 wafers a month, to HBM. While China may struggle to catch up quickly, analysts warn the bigger risk is price disruption as legacy DRAM output shrinks and AI-focused memory expands. TrendForce expects narrowing price gaps between HBM3E and DDR5, potentially squeezing margins below HBM4.
AI & Enterprise
Intel unveils next-generation memory to challenge HBM in AI market
Intel has signalled a structural shift in the semiconductor memory market by promoting Z-angle Memory, or ZAM, a next-generation vertical-stacked memory designed to replace high-bandwidth memory. Intel is set to disclose the technology in an upcoming VLSI Conference paper. The company backs development while Japan-based Saimemory Corporation, a SoftBank subsidiary, leads commercialisation. ZAM is expected to compete with HBM4 intended for Nvidia’s next-generation AI platform.
Industry
GPU rental rates jump 40 percent in six months as HBM, DRAM shortages deepen
Nvidia’s H100 GPU rental prices have jumped 40 percent in six months, with supply for new deployments already sold out and on-demand capacity exhausted, SemiAnalysis said. Surging demand is lifting AI server component costs and tightening supplies of high-bandwidth memory and DRAM. DS Investment & Securities said memory contract prices are likely to keep rising through the fourth quarter, while long-term supply deals may support margins for Samsung Electronics and SK Hynix.
