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AI chip glass substrate supply chain race enters round two, expands into materials alliances

Competition over glass substrates, a next-generation semiconductor packaging material, is shifting from individual company technology validation to a race to build supply chains led by materials alliances. Samsung Electro-Mechanics has moved to set up a 480 billion won joint venture with a Sumitomo Chemical group affiliate. The move sharpens its rivalry with SKC, whose unit Absolics has completed construction of a glass substrate mass-production line in Georgia.