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Industry

Wafer supply bottleneck drives longer-term contracts

As supply bottlenecks for AI semiconductors spread from high-bandwidth memory and substrates to silicon wafers, long-term supply agreement terms have extended to as long as 10 years from a standard 3 to 5 years. Wafer capacity expansion has stalled while advanced packaging has increased wafer consumption. Micron provided $500 million in strategic financing to GlobalWafers and signed a 10-year agreement. South Korean memory makers are also shifting toward 5-year-plus lock-in and capacity-linked contracts.

Industry

Apple\'s $1 billion chip output stuck at TSMC as DRAM shortage delays final packaging

Apple’s next-generation mobile chip, believed to be the A20 Pro, is reportedly unable to enter final packaging at TSMC because of a shortage of DRAM. About $1 billion worth of completed Apple silicon wafers is waiting to move to the next process. Production volume and yields are said to be solid, but required LPDDR5X memory has not arrived. With a new packaging structure integrating processor and DRAM at the wafer stage, Apple cannot stockpile chips without memory.