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Industry

HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view

As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.

Industry

Justem secures 30 billion won semiconductor policy funding from KDB

Justem has secured 30 billion won in semiconductor policy funding from the Korea Development Bank to speed construction of a third plant and expand research and development investment, it said on May 18. The financing is a fiscal-linked fund that KDB provides for facility investment to strengthen semiconductor manufacturing capabilities. Justem said it obtained the funding at an ultra-low interest rate with a 10-year repayment term.

Industry

Dutch chip equipment maker Besi sees surge in hybrid bonding orders on AI infrastructure investment

Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posted strong quarterly results, benefiting from expanding investment in AI infrastructure. Besi recorded first-quarter revenue of 185 million euros and net profit of 52 million euros, according to a recent report by Techzine. Its order backlog rose and beat analysts\' forecasts, more than doubling on an annual basis. CEO Richard Blickman highlighted particularly strong demand for hybrid bonding systems.