Search results for hybrid bonding
Industry
Dutch chip equipment maker Besi sees surge in hybrid bonding orders on AI infrastructure investment
Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posted strong quarterly results, benefiting from expanding investment in AI infrastructure. Besi recorded first-quarter revenue of 185 million euros and net profit of 52 million euros, according to a recent report by Techzine. Its order backlog rose and beat analysts\' forecasts, more than doubling on an annual basis. CEO Richard Blickman highlighted particularly strong demand for hybrid bonding systems.
Industry
Lam Research, Applied Materials consider acquiring Dutch chip equipment maker BESI
Dutch chip equipment maker BE Semiconductor Industries (BESI) has emerged as a potential acquisition target for major U.S. chip equipment companies. Lam Research and Applied Materials are reported to be considering a takeover. Reuters reported talks began in mid-2025, were paused early this year amid geopolitical tensions between the United States and the European Union over Greenland, and have recently resumed. BESI has selected Morgan Stanley as adviser and says it will remain independent.
Industry
Hanwha Semitec completes development of second-generation hybrid bonder
Hanwha Semitec has developed a second-generation hybrid bonder and plans to deliver the SHB2 Nano to customers in the first half of this year for performance testing, the company said on Tuesday. The equipment directly bonds chips on copper surfaces and is seen as a next-generation technology for boosting performance and productivity of high-bandwidth memory for AI semiconductors. Hanwha Semitec also aims to strengthen its position in the TC bonder market and is developing a second-generation TC bonder.
