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Industry

Hanwha Semitec showcases advanced packaging lineup at Semicon Taiwan

Hanwha Semitec will take part in Semicon Taiwan 2026 at the Nangang Exhibition Center in Taipei and introduce four advanced packaging tools, the company said on Tuesday. It will exhibit the SFM5 Square fan-out panel-level packaging tool, the SFM5 Expert 3D TC bonder, the SFM5 TnR 2.5D CoW bonder and the SHB2 Nano hybrid bonder. The SFM5 Square will be shown as a physical unit for the first time.

AI & Enterprise

U.S. chip stock selloff spreads to Asia, SoftBank slides 8 percent

Japanese technology shares fell sharply as a selloff in U.S. semiconductor stocks spread across Asia, CNBC reported on Thursday. SoftBank dropped 8.8 percent, while Tokyo Electron fell 9 percent and Advantest slid 9.4 percent. Kioxia sank more than 14 percent after a Texas federal jury found infringement of Viasat memory technology patents and ordered $229 million in damages. South Korean markets were shut for a holiday.

Finance

SoftBank shares tumble more than 12 percent on Apple shock; Samsung, SK Hynix slide

SoftBank Group shares fell more than 12 percent on June 26, leading declines in Asian technology stocks as concerns grew that higher Apple component costs could squeeze profitability through rising AI infrastructure expenses. Weakness in Arm Holdings added to the drop. In Asia, SK Hynix and Samsung Electronics slid nearly 5 percent. In Japan, Advantest fell more than 6 percent and Tokyo Electron dropped over 2 percent.